Micron advanced NAND fab
A new wafer fabrication facility broke ground in January 2026 inside Micron’s Singapore manufacturing complex.
Follow the facts, compare the plans and explore what is missing. No account needed.
The linked source supports the reported stage. Targets remain subject to change.
- Status evidence
- 27 Jan 2026
- Record checked
- 9 Sept 2026
Status & scale
First wafer output in H2 2028 (target)
About US$24bn — Plan over 10 years. Micron ↗
Why it matters
Editorial contextNAND provides storage rather than HBM’s high-bandwidth working memory. These are separate expansions within the same manufacturing complex.
Questions to follow
Research prompts · not assertions of future events- Does the first-wafer target change as construction progresses?
- How much capacity is eventually installed versus merely planned?
Location precision
Shared North Coast campus reference; the new fab footprint is not verified.
Geographic reference ↗Evidence & sources
- Advanced wafer fabrication facility groundbreaking ↗
Micron · 27 Jan 2026 · accessed 9 Sept 2026
Recorded history
- 27 Jan 2026 — New advanced NAND fab breaks ground. Source ↗
Wider context
National AI Strategy · 2026 update
Editorial context about AI infrastructure and adoption; these links do not establish programme funding or formal participation.
Read the policy source ↗Edition reviewed 10 Sept 2026. Evidence dates do not imply a live site inspection. Campus and area references do not establish exact building footprints.