VSMC 300mm wafer fab
The VIS–NXP joint venture broke ground on its first Singapore 300mm wafer fab in December 2024.
Construction · reported 4 Dec 2024Vanguard International Semiconductor / NXP
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Follow the facts, compare the plans and explore what is missing. No account needed.
Official source
The linked source supports the reported stage. Targets remain subject to change.
- Status evidence
- 4 Dec 2024
- Record checked
- 9 Sept 2026
Status & scale
Production in 2027 (target)
About US$7.8bn — Planned investment. VSMC ↗
Why it matters
Editorial contextA new foundry project broadens the manufacturing ecosystem serving automotive, industrial and consumer markets.
Questions to follow
Research prompts · not assertions of future events- Do construction and equipment installation milestones support the production target?
- Which announced customers or technology platforms become operational?
Location precision
Tampines Industrial Avenue 1 street reference. VSMC lists no. 2; exact fab geometry remains unverified.
Geographic reference ↗Evidence & sources
- 300mm fab groundbreaking ↗
VSMC · 4 Dec 2024 · accessed 9 Sept 2026 - Company contact and site address ↗
VSMC · Publication date not stated · accessed 9 Sept 2026
Recorded history
- 4 Dec 2024 — New wafer fab breaks ground. Source ↗
Edition reviewed 10 Sept 2026. Evidence dates do not imply a live site inspection. Campus and area references do not establish exact building footprints.